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Technical Data

Diamond properties
Sapphire glass
Other Materials

We have several types of processing machines and a full range of evaluation equipment at our plant.
We can customise our products to fit your specifications. Please refer to our technical data by clicking the following link.

Diamond properties

Mechanical properties

Expansion into ultra-precision polishing

Market requirements

1. Higher Precision

Finished surface is grain size dependent

2. Alternatives to CMP

High speed and ultra-mirror surface requirement
Limitations of chemical reactions

Technical Challenges

1. Atomisation

   Precise classification technology
   Dispersibility (coarsening due to agglomeration)
   Handling properties

2. Abrasive Properties

Reduction of micro-cracks

3. High Purity

Refining technology

Density [g/cm3]

Hv[kg/mm2]

Diamond

3.52

10,000

c BN

3.48

5,000

Boron carbide

2.52

3,500

Silicon carbide

3.19

2,400

Alumina

3.90

1,800

Ultra hard carbide

>10.0

1,800

Silicon nitride

3.25

1,600

Zirconia

6.05

1,300

Quartz

2.66

1,000

Sliding characteristics

Characteristics required for sliding materials

→Same features with ultrafine-grained diamonds

1. Wear Resistance

Hardness dependency (diamond = No. 1)

2. Low Friction Coefficient

Ultrafine-grained diamond μ ＜ 0.1

3. High Durability

(Maximum PV, High Elastic Modulus)

4. Affinity with Other Materials

Not suitable for Fe-based materials

5. Corrosion Resistance

Diamond = chemically stable

Challenges: Coating, mass production, processing etc.

Friction Coefficient

Stability

Si substrate

0.12-0.18

Polycrystalline

0.04-0.05

3min.

Nano

0.04-0.05

10min.

Thermal and Electrical Properties

Properties required for heat sink materials.

1. Thermal Conductivity = High
2. Thermal Expansion Coefficient = Low
3. Dielectric Constant = Low
4. Insulation (Specific Resistance) = High
5. Stability of Properties
6. Adhesion = Good

Challenges: Difficult formability, mass production, cost competitiveness, etc.

	Thermal Conductivity [W/m-K].	Linear Expansion Coefficien [x10-6/K].	Specific Resistance [Ω-cm].	Dielectric Constant [1MHz].	Dielectric Strength [kV/mm].
Diamond	2000	2.3	10¹⁶	5.6	350
Al²O³	20	8.0	>10¹⁴	9.2	14
SiC	60-490	4.2	<10⁶	4.4	400
AlN	70-260	4.7	>10¹⁴	8.7	15
BeO	250	7.8	>10¹⁴	6.5	10
Silicon Si	150	2.6	-	11.8	30
Silver Ag	430	19.1	1.6x10^-6	-	-
Copper Cu	400	16.8	1.7x10^-6	-	-

Excellent properties as semiconductor
material Diamond substrate

↑Seed crystal for crystal growth

1. high band gap and thermal conductivity → High temperature compatibility
2. High mobility and dielectric strength → High speed and power compatibility
3. High saturation velocity and dielectric breakdown voltage → High frequency compatibility
4. Low dielectric constant → High speed compatibility

	Lattice constant [Å]	BandGap [eV]	Mobility[cm2/V-s]		Saturation Electron Velocity [cm/s]	Dielectric Breakdown Voltage [kV/mm]
	Lattice constant [Å]	BandGap [eV]	(Electron)	(Hole)	Saturation Electron Velocity [cm/s]	Dielectric Breakdown Voltage [kV/mm]
Diamond	3.57	5.47	1800	1600	2.5x10⁷	>350
3C-SiC	4.36	2.23	1000	700	2.7x10⁷	400
6H-SiC	3.09	2.93	500	-	2.0x10⁷	250
Silicon Si	5.43	1.12	1500	600	1.0x10⁷	30
GaAs	5.65	1.43	8000	400	2.0x10⁷	40
GaN	3.19	3.39	900	-	2.7x10⁷	40
ZnSe	5.67	2.67	-	-	-	-

Other properties.

1.Toughness 7.5 (equivalent to quartz)
2.Optical properties Single refractive index, refractive index 2.417, dispersion 0.044, transparency
3.X-ray transparency available
4.Excellent chemical resistance
5.Acoustic material properties / Specific elastic modulus:325[10¹⁰dyne/g/cm]
Propagation velocity:18,000 [m/sec].
6.Catalyst Carrier

(e.g.) 2-PA decomposition activity (300 °C)

Confirmation that surface treatment by calcination and acid treatment results in a highly active acidic catalyst

Sapphire Glasses

One example of sapphire polishing

Polishing Condition

Polishing Material

Sapphire for LED (C Aspect)

Polishing Plate

Copper/12inches

Polishing Time

30minutes

Polishing Load

1.2kg/cm2

Rotational Rate

90rpm

Gvaluation Result

SCM FINE
DIAMOND

Mono-Crystalline
Diamond

Size

1-3micron

D50

1.52

1.61

Surface Roughness Ra(μm)

0.009

0.012

Surface Roughness Rmax(μm)

0.092

0.168

Removal Rate

16.8

5.4

SCM FINE DIAMOND

Mono-Crystalline Diamond

Other Materials

Our polycrystalline diamond powder product “SCM FINE DIAMOND” shows extremely high performance in precision polishing of ceramics and other hard materials, compared with the monocrystalline diamond powder which has been widely used in the past.
Digital technology is developing by the day and the importance of precise polishing for ceramics and other hard materials is increasing more than ever. Our SCM FINE DIAMOND is now becoming vital for the tech industry.

難加工材の研磨速度の一例

Polishing material

Mono-Crystalline
Diamond

SCM FINE
DIAMOND

Sapphire

3.2x

Ferrite

3.5x

Zirconia

1.8x

Alunina

1.8x

Silicon Carbide(SiC)

2.0x

Cemented Carbide(WC)

2.2x

Stainless Steels(SUS)

1.6x